
Integrated Spin Coating, Baking, Developing & Thickness Measurement
An automated system for evaluating photoresist development characteristics through real-time spectroscopic thickness measurement and automatic ADR calculation.
| Specification | Value |
|---|---|
| Wafer Size | 4" / 6" |
| Batch Capacity | 2 × 25 Slots |
| Measurement Range | Hundreds of Å – 30,000 Å |
| Processing Time | Approx. 5 min / Wafer |
| ADR Output | Å/sec |
| Category | Description |
|---|---|
| Integrated Process | Spin Coating · Bake · Develop · Measure |
| Automated Operation | Unmanned Batch Processing |
| Real-time Measurement | In-situ Spectroscopic Thickness Measurement |
| ADR Calculation | Automatic Develop Rate Calculation (Å/sec) |
| Data Analysis | Multi-area Thickness Analysis & Linear Regression |
| Automatic Reporting | PDF / Excel Report Generation |
| Module | Description |
|---|---|
| Spin Coater | 6-channel Syringe Pump, Multi-nozzle Dispensing |
| Bake Unit | Hot Plate with PID Temperature Control |
| Develop Unit | Immersion-type Development System |
| Measurement Unit | Real-time Spectroscopic Thickness Measurement |
| Wafer Handling | Automatic Transfer Robot & Aligner |
| Control System | Mitsubishi PLC-based Integrated Control |
| Item | Specification |
|---|---|
| Wafer Compatibility | 4-inch / 6-inch (Automatic Detection) |
| Batch Capacity | 2 Cassette Ports × 25 Slots |
| Coating Unit | 1 Spin Coater |
| Syringe Pump | 6 Channels (Adjustable) |
| Bake Unit | Hot Plate with PID Temperature Control |
| Develop Unit | 2 Measurement Tanks |
| Dosing Pump | 2 Channels |
| Measurement Method | Spectroscopic Reflectance-based Thin Film Measurement |
| Measurement Range | Hundreds of Å – 30,000 Å |
| Analysis | Multi-area Simultaneous Analysis |
| Processing Time | Approx. 5 min / Wafer |
| Analysis Results | ADR, Thickness, Uniformity |
| Data Output | PDF / Excel / Raw CSV |
| Control System | Mitsubishi PLC + Dedicated Software |
| Safety | EMO, Motion E-Stop, Safety Interlocks |
Specifications are based on standard configurations. Actual performance and detailed specifications may vary depending on materials, recipes, and customer requirements.
SmartThick – Equipment Operation Software
DevelopAnalyser – Data Analysis Software
Coating, baking, developing and measurement in a single platform.
Continuous thickness monitoring during the development process.
Automatic calculation of development rates using thickness-time regression analysis.
Automatic wafer handling and batch processing for continuous evaluation.