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PRODUCT

알칼리용해속도측정기 / Development Rate Monitor

TMC-ADR


TMC-ADR
Development Rate Monitor

Photoresist Develop-Rate Evaluation System

Integrated Spin Coating, Baking, Developing & Thickness Measurement

An automated system for evaluating photoresist development characteristics through real-time spectroscopic thickness measurement and automatic ADR calculation.


SpecificationValue
Wafer Size4" / 6"
Batch Capacity2 × 25 Slots
Measurement RangeHundreds of Å – 30,000 Å
Processing TimeApprox. 5 min / Wafer
ADR OutputÅ/sec





1. Key Features

CategoryDescription
Integrated ProcessSpin Coating · Bake · Develop · Measure
Automated OperationUnmanned Batch Processing
Real-time MeasurementIn-situ Spectroscopic Thickness Measurement
ADR CalculationAutomatic Develop Rate Calculation (Å/sec)
Data AnalysisMulti-area Thickness Analysis & Linear Regression
Automatic ReportingPDF / Excel Report Generation

2. System Configuration

ModuleDescription
Spin Coater6-channel Syringe Pump, Multi-nozzle Dispensing
Bake UnitHot Plate with PID Temperature Control
Develop UnitImmersion-type Development System
Measurement UnitReal-time Spectroscopic Thickness Measurement
Wafer HandlingAutomatic Transfer Robot & Aligner
Control SystemMitsubishi PLC-based Integrated Control

3. Main Specifications

ItemSpecification
Wafer Compatibility4-inch / 6-inch (Automatic Detection)
Batch Capacity2 Cassette Ports × 25 Slots
Coating Unit1 Spin Coater
Syringe Pump6 Channels (Adjustable)
Bake UnitHot Plate with PID Temperature Control
Develop Unit2 Measurement Tanks
Dosing Pump2 Channels
Measurement MethodSpectroscopic Reflectance-based Thin Film Measurement
Measurement RangeHundreds of Å – 30,000 Å
AnalysisMulti-area Simultaneous Analysis
Processing TimeApprox. 5 min / Wafer
Analysis ResultsADR, Thickness, Uniformity
Data OutputPDF / Excel / Raw CSV
Control SystemMitsubishi PLC + Dedicated Software
SafetyEMO, Motion E-Stop, Safety Interlocks

Specifications are based on standard configurations. Actual performance and detailed specifications may vary depending on materials, recipes, and customer requirements.

4. Software

SmartThick – Equipment Operation Software

  • Integrated Process Control
  • Recipe Management
  • Real-time Process Monitoring
  • Automatic Batch Operation
  • Safety Interlock & Alarm Management

DevelopAnalyser – Data Analysis Software

  • Automatic ADR Calculation
  • Multi-area Regression Analysis
  • Statistical Analysis (Average / Deviation)
  • Automatic PDF & Excel Reporting
  • Measurement History & Data Reanalysis

5. Key Advantages

Integrated PR Evaluation

Coating, baking, developing and measurement in a single platform.

Real-time In-situ Measurement

Continuous thickness monitoring during the development process.

Automated ADR Calculation

Automatic calculation of development rates using thickness-time regression analysis.

Unmanned Batch Operation

Automatic wafer handling and batch processing for continuous evaluation.